Adeia’s complaints highlight that AMD’s recent 3D V-Cache processors utilize hybrid bonding technology. This advanced method connects chips by directly joining planarized copper and dielectrics at a fine pitch, instead of relying on traditional solder microbumps.
By enabling dense, short interconnects between stacked dies, hybrid bonding significantly improves both bandwidth and power efficiency. This innovation plays a key role in enhancing the performance of AMD’s latest processors.
https://www.techspot.com/news/110121-amd-faces-patent-lawsuit-over-hybrid-bonding-used.html